03.08.2010 eld83npt5.doc 1 of 10 multi-quantum well (mqw) laser diode specification model: eld83npt5
03.08.2010 eld83npt5.doc 2 of 10 catalog 1. scope ???????????????????????????????????????..3 2. outline dimensions and terminal connections ?????????????? ??????3 3. ratings and characteristics ????????????????????????????..4 4. reliability ????????????????????????????????????..5 5. incoming inspection ????????????????? ???????????????..6 6. supplements ????????????????????????????????????..7 7. operation note ?????????????????????????????????..7 8. quality assurance ?????????????????????????????????.. 8 9. security ?????????????????????????????????????.9 10. note ?? ????????????????????????????????????.9
03.08.2010 eld83npt5.doc 3 of 10 1 scope: the specification covers the appearance and characteristics of 830nm laser diode used as light source, it?s model is eld83npt5.this product is packaged with an algaas multiple quantum well invisible laser diode chip and a silicon photodiode for monitoring optical power output. oscillation transverse mode of this model is te. 2. outline dimensions and terminal connections average single quality0.31g general tolerance: 0.2 unit: mm no. component material finish a laser diode chip algaas b photodiode chip si c stem fe gold-plated d cap kovar nickel-plated e window glass glass n = 1.49 f lead pins kovar gold-plated 3. ratings and characteristics
03.08.2010 eld83npt5.doc 4 of 10 3 1 absolute maximum ratings (tc=25 (case temperature)) parameter symbol value unit optical power output (cw) po 7 mw laser diode vrl 2 v reverse voltage photodiode vrd 30 v operating temperature case temperature tc -10 ~ +55 storage temperature case temperature tstg -40 ~ +85 3-2 electro-optical characteristics note 1 tc 25 ? parameter condition symbol min. typ. max unit threshold current cw ith - 20 30 ma operating current iop - 30 45 ma operating voltage vop - 2.0 2.3 v wavelength p 820 830 840 nm lateral beam angle note 2 3 ? 8 12 16 degree vertical beam angle note 2 3 ? 20 30 35 degree monitor current cw po=5mw im 250 500 a slope efficiency cw d 0.4 0.5 0.8 note 1) initial value, continuous work. note 2) angle of 50% peak intensity full angle at half-maximum note 3) parallel to the junction plane x-z plane perpendicular to the junction plane y-z plane
03.08.2010 eld83npt5.doc 5 of 10 4. reliability 4-1 the reliability of product satis fy all the items listed below. reliability 90 no. test test conditions reference standard sampler : n defective c ltpd (%) 1 solder ability soldering temperature 250 5 immersion time 5 0.5 second brand iron should be grounded gjb-128a 11 0 20 2 terminal strength tensile test load 5n duration 10 1s once for each terminal gb-4937 11 0 20 3 terminal strength bending test load 2.5n 0 ~ 90 ~ 0 ~ 90 ~0 once for each terminal gb-4937 11 0 20 4 mechanical shock acceleration 14,700m/s 2 pulse width 0.5ms direction: x,y,z five times for each direction gjb-548a 11 0 20 5 variable frequency vibration acceleration 196m/s 2 frequency 20 2000 20hz 4min reciprocation x,y and z four times for each direction gjb-548a 11 0 20 6 temperature cycling lower temperature 40 higher temperature 85 duration 5 times stay for 3h switch time:3min gb-2423.22 11 0 20 7 sealing helium gas to detect fine leaks: 5 10 3 pa cm 2 /s in fluorocarbon liquid 125 5 no bubble gjb-128a 11 0 20 8 high temperature storage temperature 85 t 96 h gb-2423.2 11 0 20 9 low temperature storage temperature 40 t 96 h gb-2423.1 11 0 20 10 moisture resistance (temperature humidity cycle) duration: from normal temperature up to 55 in 3h,stay for 9h,down to 25 in 3h stay for 9h. repeat 6 times. humidity is 95% gb-2423.4 11 0 20
03.08.2010 eld83npt5.doc 6 of 10 4-2 parameters to be measured and failure criteria * solder ability test: solder must co ver at least 95% of t he total immersed area. * terminal strength test (tension/bending);terminal sha ll not be destroyed or loosened. 4-3 target lifetime the target mean time to failure(mttf)of this product is more than three thousand hours. mttf is to be confirmed by performing the operating test under the followi ng conditions once in six months. samples tested should have a laser diode chip with the same structure of this model. note 1 defective samples caused by surge current is rejected . 5. incoming inspection 5-1 inspection standards : gb-2828-87 ,normal inspecti on,1 time sample scheme. 5-2 inspection level: ii 5-3 aql 5-3-1 definition of the lot the day shipping the product 5-3-2 characteristics aql(%) parameter failure judgment criteria 1.0 ith, iop, vop, d, p, , ,im not conforming to the specification 5-3-3 appearance aql(%) failure judgment criteria 1.0 parameters of stem and cap are not conforming th e specification rust cracking dirt bend * inspection is performed afte r blowing the window glass. no. parameters failure judgment criteria 1 operating current iop initial operating current 1.2 2 operating voltage vop initial operating voltage 1.1 3 monitor current im initial operating value 0.8 or im initial operating value 1.2
03.08.2010 eld83npt5.doc 7 of 10 6 supplements 6.1 ods materials this product shall not contain the following material s. also the following materials shall not be used in the production process for this product. materials for ods:cfcs halon carbon tetrachloride ,etc. 6.2 brominated flame retardants 6.3 packing 6.3.1 packing method 1 laser diodes are packaged in an anti-static-plastic box. 2 each anti-static-plastic box can a ccommodate 100 laser diodes maximum. 3 5 anti-static-plastic box is piled up t ogether and enlaced with an elastic band. 4 the above bound boxes are stuffed into a clean an ti-static-bag ,then this is vacuumized and sealed thermally. 5 each packing case can accommodate 500 laser di odes, which is the minimum unit of packing. labels where the model number, quantity and lot number are printed are struck on both of the bag and on the case refer to 6.3.4 . 6.3.2 packing materials no. component parts material 1 laser tray conductive polystyrene resin 2 package bag anti-static plastic 3 package box cardboard 6.3.3 case appearance
03.08.2010 eld83npt5.doc 8 of 10 6.3.4 label 1 a label on the clean- bag to type g. w t qty n.wt lot no. l 38 cm m.date w 29 cm c/no. h 14.5 cm 7. operation note 7.1 absolute maximum ratings if an excessively large current flows in a lase r diode, a large optical output will occur and the emitting facet may sustain damage.this optical dam age can occur even with momentary over-current. for this reason, absolute maximu m ratings which must not be e xceeded even momentarily have been established. exercise particular c aution with respect to the drive vo ltage supply and static electricity. we guarantee use within the absolute maximum ra tings. these ratings are established for a case temperature of 25 . as the temperature of a laser diode in creases, its maximum output will decrease and the operating range will shrink.even when opera ted within the absolu te maximum ratings, operation at high temper ature will result in a shorter life than operation at low temperature. for this reason, the design should incl ude sufficient margin for heat radiation and light output. 7.2 heat radiation conditions like other semiconductors, prolonged operation of a laser diode will cause heat to build up at junctions and increased case temperature. for this reason, attach aluminum , copper (or other) heat sinks (at least 30 30 3mm) to the stem of the laser. 7.3 protection against damage due to elect rostatic discharge and other current surges electrostatic discharge and other current surg es can cause deterioration and damage in laser diodes, resulting in reduced reliability ,we advis e taking the following protective measures : 7.3.1 ground the device and circuits. install surge filters, surge reduction transformers, or other electrostatic discharge protectors in the power supply inputs. 7.3.2 when working with laser diodes wear anti-st atic clothing, including footwear and caps. materials should be selected carefully. grounded wrist should al ways be worn while working with laser diodes, and the strap should be grounded through a 1 m ? resistance. model: lot no : po: mw chip lot qty(pcs) m . date: qty: pcs
03.08.2010 eld83npt5.doc 9 of 10 7.3.3 use anti-static cont ainers for transport and storage. 7.3.4 laser deterioration and damage can occur due to excessive current spikes when the power is turned on or off. design circuits to avoi d the generation of excessive current spikes. 7.3.5 inductive surges near equi pment that emits high frequency emi can damage or destroy lasers. avoid using lasers near fluorescent la mps or other sources of emi emissions. 7.4 soldering use a grounded soldering iron to solder laser leads. solder at a temperature of no more than 250 for a maximum of 3 seconds, at a point at least 2 mm from the base of the leads . 7.5 handling laser diodes never touch the glass window of the laser. a damaged or dirtied wi ndow will impair the performance of the laser. 7.6 handling packages due to the glass window in each device, packages must not be dr opped or subjected to excessive pressure. 7.7 safety it is extremely dangerous to look, either directly or through a lens, at the laser beam emitted from a laser diode. use a tv camera or other si milar device to adjust the optical axis. 8. quality assurance 8.1 laser diodes (semiconducto r lasers) have a much longer life t han other lasers such as gas or solid-state lasers. the components of our lasers ha ve optimum characteristic ranges. to ensure these characteristics and product life, we manufacture our laser di odes based on comprehensive data control using our own custom manufactu ring, measuring, and inspection equipment. 8.2 quality assurance system 8.2.1 after the wafers have be en manufactured, electric al and optical characte ristics are measured to verify that characteristics can be achiev ed as the manufacturing process progresses. 8.2.2 in-process inspections are conducted at various manufacturing points to ensure the stability of our assembly operations. 8.2.3 all products are burned-in to minimize initial and random failures. 8.2.4 characteristics of all products are tested before shipping. 8.2.5 products are managed by wafer lot. 8.2.6 reliability tests are performed on randomly selected samples. 8.3 quality assurance measures 8.3.1 materials, manufactu ring conditions, and inspection are controlled and maintained based on company set standards. temperature, dust, humidity and other environmental conditions are also controlled based on company standards. 8.3.2 measurement instrument s used during the manufacturing pr ocess are regularly inspected and calibrated based on company m easurement control standards. 9. security the laser beam emitted from a laser diode is almost invisible to both the human eye and the animal eye, however, it will injure the eye and suff icient caution must be ex ercised to avoid direct exposure or exposure through a fiber to t he beam when a laser diode is in operation. to adjust the optical axis or perform other simila r work, we recommend using an infrared-sensitive itv camera. we also recommend that protective glasses be worn 10. note no unauthorized transmission or reproduc tion of this specificat ion, either in whole or in part, is permitted. the contents of these sheets ar e subject to change without notice. always verify before use that the contents are the latest specifications. if, by any chance, a de fect should arise in the equipment as a result of use without verifica tion of the specificat ions, manufacturer, c an bear no responsibility
03.08.2010 eld83npt5.doc 10 of 10 whatsoever. upon the sale of any such devices; other than fo r the buyer?s right to us e such devices itself, resell or otherwise dispose of the same; no expre ss or implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by us, is granted to any such buyer. the products listed in this specification are designed to be used with ordinary electronic equipment or devices (such as audi o-visual equipment, office-autom ation equipment, communications devices, electrical appliances, and electronic toys). should you inte nd to use these products with equipment or devices which require an extremely high level of reliab ility and the malfunction of which would directly endanger human lif e (such as medical instrument s, transportation equipment, aerospace machinery, nuclear-reacto r controllers, fuel controllers, or other safety devices) please be sure to consult with our sale s representatives in advance. 10.5 when exporting, please be sure to consult with our sales repr esentatives to ascertain whether any product is classified as a strategic material.
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